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台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振

尺寸3.2*2.5mm,频率27MHZ


台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振,尺寸3.2*2.5mm,频率27MHZ,台湾无源晶振,陶瓷晶振,四脚无源晶振,水晶振动子,SMD晶体谐振器,无源晶振,无源贴片晶振,四脚无源晶体,轻薄型晶体,环保晶振,3225mm贴片晶振,无线通讯晶振,智能家居晶振,平板电脑专用晶振,小型设备专用晶振,网络设备晶振,消费电子专用晶振,仪器设备晶振,数字音频晶振,具有良好的耐压性能以及广泛的选择空间.

陶瓷晶振外观本身使用陶瓷面封装,充分的密封性能,可确保其高可靠性,采用编带包装,外包装采用朔胶盘,可在自动贴片机上对应自动贴装等优势.台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振.


订购热线:0755-27839151

台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振,尺寸3.2*2.5mm,频率27MHZ,台湾无源晶振,陶瓷晶振,四脚无源晶振,水晶振动子,SMD晶体谐振器,无源晶振,无源贴片晶振,四脚无源晶体,轻薄型晶体,环保晶振,3225mm贴片晶振,无线通讯晶振,智能家居晶振,平板电脑专用晶振,小型设备专用晶振,网络设备晶振,消费电子专用晶振,仪器设备晶振,数字音频晶振,具有良好的耐压性能以及广泛的选择空间.

陶瓷晶振外观本身使用陶瓷面封装,充分的密封性能,可确保其高可靠性,采用编带包装,外包装采用朔胶盘,可在自动贴片机上对应自动贴装等优势.台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振.

耐振低频进口谐振器,大型7050mm贴片晶体,CX5晶振

台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振     参数表

ITEM                                            TYPE parameter
Frequency Range 27MHZ
52MHz~20MHZ 20~28MHz 28~50MHz
Mode Fundamental
Frequency Tolerance (at. to 25 C) ±10ppm~±50ppm( at.25 C)
Frequency Stability (Temp.) ±12ppm,±15ppm,±20ppm,or Specify
Operating Temp. Range  -10~+60 C,or Specify
Load Capacitance series, 8pF,10pF,12pF,or Specify
Drive Level 10μW (100μW Max.)
Equivalent Series Resistance 120Ω Max. 80Ω Max. 60Ω Max. 50Ω Max.
Storage Temp. Range -40~+125 C
Thermistor Resistance(25 C) 100KΩ
Thermistor B-constant(25~50 C) 4250K
耐振低频进口谐振器,大型7050mm贴片晶体,CX5晶振

台湾加高晶振,X3GO27000BA1H-HU,HSX321G低功耗晶振,6G物联网晶振    尺寸图

HSX321G 3225

无源晶振产品特性:

小尺寸

低功耗,高可靠性能

优异的老化特性

符合RoHS标准且无铅

HSX321G 1

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耐振低频进口谐振器,大型7050mm贴片晶体,CX5晶振

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